| Item | Description |
| Layer | 1- 24 Layers |
| Material |
FR-4/CEM-1/CEM-3/Aluminum/copper base material/ High-TG FR-4 /Teflon/PTFE/ Rogers/PI/ etc. |
| Board Thickness | Finish Thickness: 0.2mm- 5.0mm |
| Min Board Size | 10*10mm |
| Max Board Size | 610*560mm |
| Board Thickness Tolerance | ≤1.0mm +/-0.1mm;≥1.0mm +/-10% |
| Copper thickness(inner&outer) | 17.5um-210um (0.5oz-6oz) |
| Min Trace Width | 3mil(0.076mm) |
| Min Spacing | 3mil(0.076mm) |
| Min Drilling Dia | 0.15mm |
| PTH copper thickness | 0.4-2mil(10-50um) |
| V-cut angle | 25°,30°,45°,60° |
| Impedance control and tolerance | Tolerance: ±10%; ±8%(min) |
| Twist&Wrap | ≤ 0.5%(min) |
| Soldermask Color | Green, Red, Blue, White, Black, Yellow, etc. |
| Surface Finish/Plating |
HASL/ L.F HASL/ Immersion Gold/ Immersion Silver/ Immersion Tin / Hard Gold Plating/ OSP/ Gold Finger/ Carbon Ink. |
| Certificate | UL Certificate,ROHS,ISO9001, ISO/TS16949,ISO14001,SGS |
| Inner packing | Vacuum packing,bubble |
| Outer Packing | exporting Standard cartoon Packing with vacuum,ties |
